TEC and McMaster University sign Collaboration Agreement to Exploit SEEBECK EFFECT.
TEC signs Mitacs agreement to help support Ph.D. fellow for one year with NSERC and McMaster.
TEC and Cegep de l’Outaouais sign letter of support to design and Test TEG Systems
Thermal Electronics Signs agreement with McMaster University to sign engage grant project
First prototype TEG design is tested showing a 6% conversion efficiency.
Thermal Electronics Corp. signs agreement with Frank Smith of T.E. Systems to develop advance TEG Design